Semiconductor memory device and method of manufacturing the same

ABSTRACT

According to an embodiment, a semiconductor memory device comprises first wiring lines, second wiring lines, and first variable resistance elements. The first wiring lines are arranged in a first direction and have as their longitudinal direction a second direction intersecting the first direction. The second wiring lines are arranged in the second direction and have the first direction as their longitudinal direction. The first variable resistance elements are respectively provided at intersections of the first wiring lines and the second wiring lines. In addition, this semiconductor memory device comprises a first contact extending in a third direction that intersects the first direction and second direction and having one end thereof connected to the second wiring line. The other end and a surface intersecting the first direction of this first contact are covered by a first conductive layer.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of and claims the benefit of priorityunder 35 U.S.C. § 120 from U.S. application Ser. No. 16/150,321 filedOct. 3, 2018, which is a continuation of U.S. application Ser. No.15/791,514 filed Oct. 24, 2017 (now U.S. Pat. No. 10,115,771 issued Oct.30, 2018), which is a continuation of U.S. application Ser. No.15/077,026 filed Mar. 22, 2016 (now U.S. Pat. No. 9,812,502 issued Nov.7, 2017), and claims the benefit of priority from U.S. ProvisionalPatent Application No. 62/212,056 filed Aug. 31, 2015, the entirecontents of each of which are incorporated herein by reference.

FIELD

Embodiments described herein relate to a semiconductor memory device anda method of manufacturing the same.

BACKGROUND Description of the Related Art

A resistance varying type memory (ReRAM: Resistive RAM), and so on, thatcan easily be made three-dimensional, has been receiving attention as amemory utilized for storing large capacity data. In such a memory, avariable resistance element is employed as a storage element. Thefollowing are employed as such a variable resistance element, forexample, CBRAM (Conduction Bridge RAM), a storage element utilizing thelikes of a chalcogenide compound or metal oxide, an MRAM elementemploying a resistance change due to a tunnel magnetoresistance effect,a storage element utilizing a conductive polymer (polymer ferroelectricRAM, PFRAM), and so on.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram of a nonvolatile semiconductor memory deviceaccording to a first embodiment.

FIG. 2 is a circuit diagram showing a configuration of part of the samenonvolatile semiconductor memory device.

FIG. 3 is a perspective view showing a configuration of part of the samenonvolatile semiconductor memory device.

FIG. 4 is a cross-sectional view showing a configuration of part of thesame nonvolatile semiconductor memory device.

FIG. 5 is a cross-sectional view showing a configuration of part of thesame nonvolatile semiconductor memory device.

FIG. 6 is a plan view showing a configuration of part of the samenonvolatile semiconductor memory device.

FIGS. 7 to 12 are cross-sectional views showing configuration of partsof the same nonvolatile semiconductor memory device.

FIG. 13 is a flowchart showing a method of manufacturing the nonvolatilesemiconductor memory device according to the first embodiment.

FIGS. 14, 17, 19, 21, 25, 30, 34, 39, 44, 47, 50, 54, 56, 60, and 62 areplan views showing the same method of manufacturing.

FIGS. 15, 16, 18, 20, 22 to 24, 26 to 29, 31 to 33, 35 to 38, 40 to 43,45, 46, 48, 49, 51 to 53, 55, 57 to 59, 61, 63, and 64 arecross-sectional views showing the same method of manufacturing.

DETAILED DESCRIPTION

A semiconductor memory device according to an embodiment comprises aplurality of first wiring lines, a plurality of second wiring lines, anda plurality of first variable resistance elements. The plurality offirst wiring lines are arranged in a first direction and have as theirlongitudinal direction a second direction intersecting the firstdirection. The plurality of second wiring lines are arranged in thesecond direction and have the first direction as their longitudinaldirection. The plurality of first variable resistance elements arerespectively provided at intersections of the first wiring lines and thesecond wiring lines. In addition, this semiconductor memory devicecomprises a first contact extending in a third direction that intersectsthe first direction and second direction and having one end thereofconnected to the second wiring line. The other end and a surfaceintersecting the first direction of this first contact are covered by afirst conductive layer.

Next, nonvolatile semiconductor memory devices according to embodimentswill be described in detail with reference to the drawings. Note thatthese embodiments are merely examples, and are not shown with theintention of limiting the present invention.

For example, a memory device employing CBRAM (Conduction Bridge RAM) isexemplified herein, but the present invention may also be applied to amemory device having another configuration. Such a memory device may beone having any configuration, for example, one employing a storageelement that utilizes the likes of a chalcogenide compound or metaloxide, one employing MRAM that utilizes a resistance change due to atunnel magnetoresistance effect, one employing a storage element thatutilizes a conductive polymer (polymer ferroelectric RAM, PFRAM), and soon. Moreover, a memory cell included in the memory device may or may notinclude a non-linear element such as a diode or transistor.

In addition, a configuration having two layers of memory mats stacked isexemplified herein as a structure of a memory cell array. However, thepresent embodiment may also be applied to a configuration having asingle layer memory mat or a configuration having three or more layersof memory mats stacked. Moreover, a configuration in which a bit line BLis shared between the stacked two layers of memory mats is exemplifiedherein. However, it is also possible to adopt a configuration in which aword line WL is shared between the stacked memory mats and to adopt aconfiguration in which wiring lines are not shared between the stackedmemory mats.

[Semiconductor Memory Device According to First Embodiment]

FIG. 1 is a block diagram of a nonvolatile semiconductor memory deviceaccording to a first embodiment. The same nonvolatile semiconductormemory device stores user data inputted from an external host 9, in acertain address in a memory cell array 1. In addition, the samenonvolatile semiconductor memory device reads user data from a certainaddress in the memory cell array 1, and outputs the user data to theexternal host 9.

That is, as shown in FIG. 1, the same nonvolatile semiconductor memorydevice comprises the memory cell array 1 that stores user data. Thememory cell array 1 comprises a plurality of memory mats MM. As shown inFIG. 2, these memory mats MM comprise: a plurality of memory cells MC1and MC2; and a bit line BL and word lines WL1 and WL2 connected to thesememory cells MC1 and MC2.

As shown in FIG. 1, the same nonvolatile semiconductor memory devicecomprises a column control circuit 2 provided in a periphery of thememory cell array 1. When performing write of user data, the columncontrol circuit 2 transfers a voltage generated by a voltage generatingcircuit 10 to a desired bit line BL, according to the user data inputtedfrom the external host 9. Moreover, the column control circuit 2comprises an unillustrated sense amplifier, and when performing read ofuser data, detects a voltage or potential of a certain bit line BL.

As shown in FIG. 1, the same nonvolatile semiconductor memory devicecomprises a row control circuit 3 provided in a periphery of the memorycell array 1. The row control circuit 3 transfers a voltage generated bythe voltage generating circuit 10 to desired word lines WL1 and WL2, andso on, according to address data inputted from the external host 9.

As shown in FIG. 1, the same nonvolatile semiconductor memory devicecomprises an address register 5 that supplies address data to the columncontrol circuit 2 and the row control circuit 3. The address register 5stores address data inputted from a data input/output buffer 4.

As shown in FIG. 1, the same nonvolatile semiconductor memory devicecomprises the voltage generating circuit 10 that supplies a voltage tothe memory cell array 1 via the column control circuit 2 and the rowcontrol circuit 3. The voltage generating circuit 10 generates andoutputs a voltage of a certain magnitude at a certain timing, based onan internal control signal inputted from a state machine 7.

As shown in FIG. 1, the same nonvolatile semiconductor memory devicecomprises the state machine 7 that inputs the internal control signal tothe voltage generating circuit 10, and so on. The state machine 7receives command data from the host 9, via a command interface 6, andperforms management of read, write, erase, input/output of data, and soon.

As shown in FIG. 1, the same nonvolatile semiconductor memory devicecomprises the data input/output buffer 4 which is connected to theexternal host 9 via an I/O line. The data input/output buffer 4 receivesuser data from the external host 9, and transfers the user data to thecolumn control circuit 2. Moreover, the data input/output buffer 4receives command data from the external host 9, and transfers thecommand data to the command interface 6. In addition, the datainput/output buffer 4 receives address data from the external host 9,and transfers the address data to the address register 5. Furthermore,the data input/output buffer 4 receives user data from the columncontrol circuit 2, and transfers the user data to the external host 9.

As shown in FIG. 1, the same nonvolatile semiconductor memory devicecomprises the command interface 6 that receives an external controlsignal from the external host 9. The command interface 6 determineswhich of user data, command data, and address data inputted to the datainput/output buffer 4 is, based on the external control signal inputtedfrom the external host 9, and controls the data input/output buffer 4.In addition, the command interface 6 transfers to the state machine 7command data received from the data input/output buffer 4.

Note that the column control circuit 2, the row control circuit 3, thestate machine 7, the voltage generating circuit 10, and so on, configurea control circuit that controls the memory cell array 1.

Next, a circuit configuration of part of the memory cell array 1according to the present embodiment will be described with reference toFIG. 2. FIG. 2 is an equivalent circuit diagram showing a configurationof part of the memory cell array 1.

As shown in FIG. 2, the memory cell array 1 comprises: a plurality ofthe bit lines BL; a plurality of the word lines WL1 and WL2; and aplurality of the memory cells MC1 and MC2 connected to these bit linesBL and word lines WL1 and WL2. These memory cells MC1 and MC2 areconnected to the row control circuit 3 via the word lines WL1 and WL2and a word line contact CW, and are connected to the column controlcircuit 2 via the bit line BL and a bit line contact CB. For example,the plurality of memory cells MC1 and MC2 connected to common word linesWL1 and WL2 store a one-page portion of user data. Moreover, theplurality of memory cells MC1 and MC2 each store a one-bit portion ofdata, for example.

The memory cells MC1 and MC2 function as a variable resistance element,and have their resistance value changed according to data stored. Forexample, the memory cells MC11 and MC13 recording “0” are in ahigh-resistance state, and the memory cell MC12 recording “1” is in alow-resistance state. Therefore, when a certain voltage is applied tothe word line WL11 (selected word line) connected to these memory cellsMC11 to MC13, a current does not flow in the bit line BL1 and bit lineBL3 connected to the memory cells MC11 and MC13, but a current does flowin the bit line BL2 connected to the memory cell MC12. Therefore, thiscurrent is detected by the column control circuit 2, whereby data of“010” is read as user data, for example. Note that the column controlcircuit 2 may detect a voltage, not the current, of the bit line BL.

In addition, the memory cells MC1 and MC2 function as a rectifierelement. Therefore, practically no current flows in the word lines WL1and WL2 (unselected word lines) other than the selected word line WL11.

Note that hereafter, a configuration including the plurality of bitlines BL, the plurality of word lines WL1, and the plurality of memorycells MC1 will be called a memory mat MM0. Similarly, a configurationincluding the plurality of bit lines BL, the plurality of word linesWL2, and the plurality of memory cells MC2 will be called a memory matMM1.

Next, a schematic configuration of the memory cell array 1 will bedescribed with reference to FIG. 3. FIG. 3 is a schematic perspectiveview showing a configuration of part of the memory cell array 1. Notethat in FIG. 3, part of the configuration is omitted. Moreover, theconfiguration shown in FIG. 3 is merely an example, and a specificconfiguration may be appropriately changed.

As shown in FIG. 3, the memory cell array 1 is a so-called cross-pointtype memory cell array. That is, the memory cell array 1 is providedwith a plurality of the word lines WL1 that are arranged in parallel ina Y direction and extend in an X direction. Moreover, provided abovethese plurality of word lines WL1 are a plurality of the bit lines BLthat are arranged in parallel in the X direction and extend in the Ydirection. Furthermore, provided above the plurality of bit lines BL area plurality of the word lines WL2 that are arranged in parallel in the Ydirection and extend in the X direction. In addition, the memory cellMC1 is provided at each of intersections of the plurality of word linesWL1 and the plurality of bit lines BL. Similarly, the memory cell MC2 isprovided at each of intersections of the plurality of bit lines BL andthe plurality of word lines WL2.

Next, the memory mat MM0 will be described with reference to FIG. 4.FIG. 4 is a cross-sectional view showing a configuration of the memorymat MM0. Note that in FIG. 4, part of the configuration is omitted.

As shown in FIG. 4, the memory mat MM0 comprises: the word line WL1; thememory cell MC1 provided on an upper surface of the word line WL1; andthe bit line BL provided on an upper surface of the memory cell MC1. Thememory cell MC1 includes a filament F having conductivity, and attainsthe low-resistance state when this filament F contacts an electrodelayer 224 and the high-resistance state when this filament F does notcontact the electrode layer 224.

As shown in FIG. 4, the word line WL1 comprises the following, forexample, namely: a barrier metal layer 211; and a conductive layer 212stacked on this barrier metal layer 211. The barrier metal layer 211 isconfigured from a conductive layer of the likes of titanium (Ti), forexample, and suppresses diffusion of an impurity when depositing theconductive layer 212, and so on. The conductive layer 212 is configuredfrom a conductive layer of the likes of tungsten (W), for example.

As shown in FIG. 4, the memory cell MC1 comprises the following, stackedsequentially on the word line WL1, namely: a barrier metal layer 221; ametal layer 222; an insulating layer 223; the electrode layer 224; abarrier metal layer 225; and a conductive layer 226. The barrier metallayers 221 and 225 are configured from a conductive layer of the likesof titanium (Ti), for example, and suppress diffusion of an impuritywhen depositing the metal layer 222 or the conductive layer 226, and soon. The metal layer 222 is configured from a metal such as silver (Ag)or copper (Cu), for example, and functions as a supply source of a metalion forming the filament F. The insulating layer 223 is configured froman insulating layer of the likes of silicon oxide (SiO₂), for example,and functions as a medium in which the filament F grows. The electrodelayer 224 is configured from a material such as tantalum silicon nitride(TaSiN), for example, and functions as an electrode contacting thefilament F. The conductive layer 226 is configured from a conductivelayer of the likes of tungsten (W), for example.

As shown in FIG. 4, the bit line BL comprises the following, forexample, namely: a barrier metal layer 231; and a conductive layer 232stacked on this barrier metal layer 231. The barrier metal layer 231 isconfigured from a conductive layer of the likes of titanium (Ti), forexample, and suppresses diffusion of an impurity when depositing theconductive layer 232, and so on. The conductive layer 232 is configuredfrom a conductive layer of the likes of tungsten (W), for example.

Note that materials of each of the configurations are merely exemplifiedones, and may be appropriately changed. For example, the insulatinglayer 223 may be formed from a material such as silicon nitride (SiN),silicon oxynitride (SiON), aluminum oxide (Al₂O₃), hafnium oxide (HfO),and so on. Moreover, the electrode layer 224 may be formed from amaterial such as amorphous silicon, polysilicon, tantalum nitride (TaN),aluminum tantalum nitride, and so on.

Next, the memory mat MM1 will be described in more detail with referenceto FIG. 5. FIG. 5 is a cross-sectional view showing a configuration ofthe memory mat MM1. Note that in FIG. 5, part of the configuration isomitted.

As shown in FIG. 5, the memory mat MM1 comprises: the bit line BL; thememory cell MC2 provided on an upper surface of the bit line BL; and theword line WL2 provided on an upper surface of the memory cell MC2.Similarly to the memory cell MC1, the memory cell MC2 also includes afilament F having conductivity, and attains the low-resistance statewhen this filament F contacts an electrode layer 242 and thehigh-resistance state when this filament F does not contact theelectrode layer 242.

As shown in FIG. 5, the memory cell MC2 comprises the following, stackedsequentially on the bit line BL, namely: a barrier metal layer 241; theelectrode layer 242; an insulating layer 243; a barrier metal layer 244;a metal layer 245; a barrier metal layer 246; and a conductive layer247. The barrier metal layers 241, 244, and 246 are configured from aconductive layer of the likes of titanium (Ti), for example, andsuppress diffusion of an impurity when depositing the electrode layer242, the metal layer 245, or the conductive layer 247, and so on. Theelectrode layer 242 is configured from a material such as tantalumsilicon nitride (TaSiN), and functions as an electrode contacting thefilament F. The insulating layer 243 is configured from an insulatinglayer of the likes of silicon oxide (SiO₂), for example, and functionsas a medium in which the filament F grows. The metal layer 245 isconfigured from a metal such as silver (Ag) or copper (Cu), for example,and functions as a supply source of a metal ion forming the filament F.The conductive layer 247 is configured from a conductive layer of thelikes of tungsten (W), for example.

As shown in FIG. 5, the word line WL2 comprises the following, forexample, namely: a barrier metal layer 251; and a conductive layer 252stacked on this barrier metal layer 251. The barrier metal layer 251 isconfigured from a conductive layer of the likes of titanium (Ti), forexample, and suppresses diffusion of an impurity when depositing theconductive layer 252, and so on. The conductive layer 252 is configuredfrom a conductive layer of the likes of tungsten (W), for example.

Note that materials of each of the configurations are merely exemplifiedones, and may be appropriately changed. For example, the electrode layer242 may be formed from a material such as amorphous silicon,polysilicon, tantalumnitride (TaN), aluminum tantalum nitride, and soon. Moreover, the insulating layer 243 may be formed from a materialsuch as silicon nitride (SiN), silicon oxynitride (SiON), aluminum oxide(Al₂O₃), hafnium oxide (HfO), and so on.

Next, the memory cell array 1 according to the present embodiment willbe described in more detail with reference to FIGS. 6 to 12. FIG. 6 is aplan view showing a configuration of part of the memory cell array 1.FIGS. 7 to 12 are cross-sectional views showing configurations of partsof the memory cell array 1, and respectively show cross-sectionscorresponding to A-A through F-F of FIG. 6. Note that in FIG. 6, part ofthe configuration is omitted.

As shown in FIG. 6, the memory cell array 1 according to the presentembodiment is provided with a plurality of memory regions MR1 and MR2.In addition, a bit line contact region BCR is provided in the Ydirection of the memory regions MR1 and MR2. Moreover, word line contactregions WCR1 and WCR2 are provided in the X direction of the memoryregions MR1 and MR2.

As shown in FIGS. 6 to 8, the memory regions MR1 and MR2 are providedwith a plurality of the bit lines BL that are arranged in parallel inthe X direction and extend in the Y direction, and a plurality of theword lines WL1 and word lines WL2 that are arranged in parallel in the Ydirection and extend in the X direction (refer to FIGS. 7 and 8). Inaddition, memory cells MC1 and MC2 are provided at intersections ofthese plurality of bit lines BL and plurality of word lines WL1 and WL2.

As shown in FIG. 6, the bit line contact region BCR is provided with aplurality of the bit lines BL that are arranged in the X direction andextend in parallel in the Y direction. In other words, the plurality ofbit lines BL are provided straddling the memory regions MR1 and MR2 andthe bit line contact region BCR. Moreover, as shown in FIGS. 6 and 7,the bit line contact CB is connected to each of these bit lines BL. Thebit line contact CB extends in the Z direction and has its upper endconnected to a lower surface of the bit line BL and its lower endconnected to a conductive layer 113 of a lower wiring line layer 100.

As shown in FIGS. 6 to 8, the word line contact regions WCR1 and WCR2are each provided with a plurality of the word lines WL1 and WL2 thatare arranged in the Y direction and extend in parallel in the Xdirection. In other words, the plurality of word lines WL1 and WL2 areprovided straddling the memory regions MR1 and MR2 and the word linecontact regions WCR1 and WCR2. Moreover, as shown in FIG. 8, in the wordline contact regions WCR1 and WCR2, the word line WL1 is connected tothe conductive layer 113 of the lower wiring line layer 100. Inaddition, as shown in FIGS. 6 and 8, the word line contact CW isconnected to each of the word lines WL2. The word line contact CWextends in the Z direction and has its upper end connected to a lowersurface of the word line WL2 and its lower end connected to theconductive layer 113 of the lower wiring line layer 100.

Now, as shown in FIGS. 6 and 9, in the present embodiment, a positionand width in the X direction of the bit line BL substantially matches aposition and width in the X direction of the bit line contact CB.Moreover, in the bit line contact region BCR, a plurality of the bitline contacts CB are lined up in the X direction with an identical pitchto that of the bit lines BL, and positions in the Y direction of theseplurality of bit line contacts CB are substantially matched.

In such a configuration, a width in the X direction of the bit linecontact region BCR can be suppressed to about the same width as that ofthe memory regions MR1 and MR2, and a width in the Y direction of thebit line contact region BCR can be suppressed to about the same width asthat of the bit line contact CB. Therefore, an area occupied by the bitline contact region BCR can be reduced.

Moreover, in the present embodiment, the bit line contact CB is formedin an inversely tapered shape when viewed from the X direction as shownin FIG. 7, and is formed in a forwardly tapered shape when viewed fromthe Y direction as shown in FIG. 9. That is, as shown in FIG. 7, in theY direction, a width WBY1 of the lower end of the bit line contact CB issmaller than a width WBY2 of the upper end of the bit line contact CB.On the other hand, as shown in FIG. 9, in the X direction, a width WBX1of the lower end of the bit line contact CB is larger than a width WBX2of the upper end of the bit line contact CB. Therefore, it is possibleto suppress a cross-sectional area of the upper end or lower end of thecontact becoming extremely small, and thereby prevent an increase inwiring line resistance.

Moreover, in the present embodiment, as shown in FIG. 7, the bit line BLand the bit line contact CB are formed integrally. Therefore, contactresistance between the bit line BL and the bit line contact CB may beignored, and wiring line resistance can be more reduced compared to whenthe bit line BL and the bit line contact CB are formed separately, forexample.

Note that in the present embodiment, as shown in FIG. 7, the lowersurface of the bit line BL and a side surface in the Y direction(surface intersecting the Y direction) and lower surface of the bit linecontact CB are covered by the barrier metal layer 231. In contrast, asshown in FIG. 9, side surfaces in the X direction (surface intersectingthe X direction) of the bit line BL and the bit line contact CB contacta nitride layer 261. However, the nitride layer 261 may be omitted. Insuch a case, the side surfaces in the X direction of the bit line BL andthe bit line contact CB sometimes contact an inter-layer insulatinglayer 228.

Moreover, in the present embodiment, as shown in FIG. 9, a side surfacein the Y direction of the bit line BL and a side surface in the Ydirection of the bit line contact CB are formed continuously.

Note that as shown in FIGS. 6 and 10, in the present embodiment, theword line contact CW is also formed substantially similarly to the bitline contact CB. That is, as shown in FIGS. 6 and 10, in the presentembodiment, a position and width in the Y direction of the word line WL2substantially matches a position and width in the Y direction of theword line contact CW. Moreover, in the word line contact regions WCR1and WCR2, a plurality of the word line contacts CW are lined up in the Ydirection with an identical pitch to that of the word lines WL, andpositions in the X direction of these plurality of word line contacts CWare substantially matched.

Therefore, in the semiconductor memory device according to the presentembodiment, not only an area of the bit line contact region BCR, butalso areas of the word line contact regions WCR1 and WCR2 can bereduced.

In addition, the word line contact CW may be formed in an inverselytapered shape when viewed from the Y direction as shown in FIG. 8, andmay be formed in a forwardly tapered shape when viewed from the Xdirection as shown in FIG. 10.

Moreover, as shown in FIG. 8, the word line WL2 and the word linecontact CW may be formed integrally.

In addition, a lower surface of the word line WL2 and a side surface inthe X direction and lower surface of the word line contact region WCR1or WCR2 may be covered by the barrier metal layer 251 as shown in FIG.8, and an upper surface and side surface of the word line WL2 and a sidesurface in the Y direction of the word line contact CW may be covered bya nitride layer 248 as shown in FIG. 10.

Moreover, as shown in FIG. 10, a side surface in the X direction of theword line WL2 and a side surface in the X direction of the word linecontact CW may be formed continuously.

[Method of Manufacturing According to First Embodiment]

Next, a method of manufacturing the semiconductor memory deviceaccording to the present embodiment will be described with reference toFIGS. 13 to 64. FIG. 13 is a flowchart for explaining the same method ofmanufacturing.

First, step S101 will be described with reference to FIGS. 13 to 15.FIG. 14 is a plan view for explaining step S101. FIG. 15 is across-sectional view for explaining step S101, and shows a cross-sectioncorresponding to A-A of FIG. 14.

As shown in FIGS. 13 to 15, in step S101, the lower wiring line layer100 is formed. For example, first, the likes of a CMOS circuit or wiringline layer configuring the control circuit described with reference toFIG. 1, are formed on an unillustrated substrate. Next, an inter-layerinsulating layer 111 is formed on this substrate, and a contact hole isformed in this inter-layer insulating layer 111. The contact hole isprovided at a position corresponding to the bit line contact CB and theword line contact CW. Next, a barrier metal layer 112 and the conductivelayer 113 are implanted on the inside of this contact hole. Theinter-layer insulating layer 111 is configured from silicon oxide(SiO₂), for example. The barrier metal layer 112 is configured from aconductive layer of the likes of titanium (Ti), for example. Theconductive layer 113 is configured from a conductive layer of the likesof tungsten (W), for example.

Next, step S102 will be described with reference to FIGS. 13 and 16.FIG. 16 is a cross-sectional view for explaining step S102.

As shown in FIGS. 13 and 16, in step S102, a layer forming the word lineWL1 and a layer forming the memory cell MC1, are deposited.

For example, first, a barrier metal layer 211A and a conductive layer212A that form the word line WL1, are sequentially deposited. Thebarrier metal layer 211A is configured from a conductive layer of thelikes of titanium (Ti), for example. The conductive layer 212A isconfigured from a conductive layer of the likes of tungsten (W), forexample.

Next, a barrier metal layer 221A, a metal layer 222A, an insulatinglayer 223A, an electrode layer 224A, a barrier metal layer 225A, and aconductive layer 226A that form the memory cell MC1, are sequentiallydeposited. The barrier metal layers 221A and 225A are configured from aconductive layer of the likes of titanium (Ti), for example. The metallayer 222A is configured from a metal such as silver (Ag) or copper(Cu), for example. The insulating layer 223A is configured from aninsulating layer of the likes of silicon oxide (SiO₂), for example. Theelectrode layer 224A is configured from a material such as tantalumsilicon nitride (TaSiN), for example. The conductive layer 226A isconfigured from a conductive layer of the likes of tungsten (W), forexample.

Next, step S103 will be described with reference to FIGS. 13, 17, and18. FIG. 17 is a plan view for explaining step S103. FIG. 18 is across-sectional view for explaining step S103, and shows a cross-sectioncorresponding to A-A of FIG. 17.

As shown in FIGS. 13, 17, and 18, in step S103, formation of the wordline WL1 is performed. For example, each of layers forming the word lineWL1 (barrier metal layer 211A and conductive layer 212A) and each oflayers forming the memory cell MC1 (barrier metal layer 221A, metallayer 222A, insulating layer 223A, electrode layer 224A, barrier metallayer 225A, and conductive layer 226A) are divided in the Y directionalong a pattern of the word line WL1. As a result of this step, the wordline WL1 (barrier metal layer 211 and conductive layer 212) is formed.

Next, step S104 will be described with reference to FIGS. 13, 19, and20. FIG. 19 is a plan view for explaining step S104. FIG. 20 is across-sectional view for explaining step S104, and shows a cross-sectioncorresponding to A-A of FIG. 19.

As shown in FIGS. 13, 19, and 20, in step S104, the inter-layerinsulating layer 228 is formed. For example, the nitride layer 227 isdeposited on sidewalls in the Y direction of each of the layers formingthe word lines WL1 (barrier metal layer 211 and conductive layer 212)and the memory cells MC1 (barrier metal layer 221A, metal layer 222A,insulating layer 223A, electrode layer 224A, barrier metal layer 225A,and conductive layer 226A) adjacent in the Y direction and on an uppersurface of the inter-layer insulating layer 111. The nitride layer 227is configured from silicon nitride (SiN), for example. Next, theinter-layer insulating layer 228 is implanted between the nitride layers227. The inter-layer insulating layer 228 is configured from siliconoxide (SiO₂), for example.

Next, step S105 will be described with reference to FIG. 13 and FIGS. 21to 26. FIGS. 21 and 25 are plan views for explaining step S105. FIGS. 22to 24 are cross-sectional views for explaining step S105, andrespectively show cross-sections corresponding to A-A through C-C ofFIG. 21. Moreover, FIG. 26 is a cross-sectional view for explaining stepS105, and shows a cross-section corresponding to A-A of FIG. 25.

As shown in FIG. 13 and FIGS. 21 to 26, in step S105, a trench Slit1 isformed in the inter-layer insulating layer 228. For example, first, asshown in FIGS. 21 to 24, masks 301, 302, and 303 covering the memoryregions MR1 and MR2 are formed. Next, as shown in FIGS. 25 and 26,anisotropic etching such as RIE is performed using these masks 301, 302,and 303, and the trench Slit1 is formed. The trench Slit1 extends in theX direction along the bit line contact region BCR. Moreover, theinter-layer insulating layer 111, barrier metal layer 112, andconductive layer 113 of the lower wiring line layer 100 are exposed at alower surface of the trench Slit1.

Next, step S106 will be described with reference to FIG. 13 and FIGS. 27to 29. FIGS. 27 to 29 are cross-sectional views for explaining stepS106.

As shown in FIG. 13 and FIGS. 27 to 29, in step S106, a layer formingthe bit line BL and bit line contact CB and a layer forming the memorycell MC2, are deposited.

For example, first, a barrier metal layer 231A and a conductive layer232A that form the bit line BL and the bit line contact CB, aresequentially deposited. The barrier metal layer 231A is configured froma conductive layer of the likes of titanium (Ti), for example. Theconductive layer 232A is configured from a conductive layer of the likesof tungsten (W), for example.

Now, as shown in FIGS. 27 and 29, the barrier metal layer 231A andconductive layer 232A cover upper surfaces of the conductive layer 226Aand the inter-layer insulating layer 228. Moreover, the barrier metallayer 231A and conductive layer 232A are implanted also on the inside ofthe trench Slit1, and contact the inter-layer insulating layer ill,barrier metal layer 112, and conductive layer 113 of the lower wiringline layer 100 at the lower surface of the trench Slit1.

Next, a barrier metal layer 241A, an electrode layer 242A, an insulatinglayer 243A, a barrier metal layer 244A, a metal layer 245A, a barriermetal layer 246A, and a conductive layer 247A that form the memory cellMC2, are sequentially deposited. The barrier metal layers 241A, 244A,and 246A are configured from a conductive layer of the likes of titanium(Ti), for example. The electrode layer 242A is configured from amaterial such as tantalum silicon nitride (TaSiN), for example. Theinsulating layer 243A is configured from an insulating layer of thelikes of silicon oxide (SiO₂), for example. The metal layer 245A isconfigured from a metal such as silver (Ag) or copper (Cu), for example.The conductive layer 247A is configured from a conductive layer of thelikes of tungsten (W), for example.

Next, step S107 will be described with reference to FIG. 13 and FIGS. 30to 46. FIGS. 30, 34, 39, and 44 are plan views for explaining step S107.FIGS. 31 to 33 are cross-sectional views for explaining step S107, andrespectively show cross-sections corresponding to A-A through C-C ofFIG. 30. FIGS. 35 to 38 are cross-sectional views for explaining stepS107, and respectively show cross-sections corresponding to A-A throughC-C, and E-E of FIG. 34. FIGS. 40 to 43 are cross-sectional views forexplaining step S107, and respectively show cross-sections correspondingto A-A through C-C, and E-E of FIG. 39. FIGS. 45 and 46 arecross-sectional views for explaining step S107, and respectively showcross-sections corresponding to C-C and E-E of FIG. 44.

As shown in FIG. 13 and FIGS. 30 to 46, in step S107, formation of thememory cell MC1, the bit line BL, and the bit line contact CB, areperformed.

For example, as shown in FIGS. 30 to 33, first, masks 311, 312, 313, and314 are formed. The mask 314 positioned in an uppermost layer is formedin a line-and-space pattern along a pattern of the bit line BL.Moreover, the masks 311, 312, 313, and 314 are formed straddling thememory regions MR1 and MR2 and the bit line contact region BCR.

Next, as shown in FIGS. 34 to 38, the masks 311, 312, 313, and 314 areutilized, and each of layers forming the memory cell MC1 (barrier metallayer 221A, metal layer 222A, insulating layer 223A, electrode layer224A, barrier metal layer 225A, and conductive layer 226A), each oflayers forming the bit line BL (barrier metal layer 231A and conductivelayer 232A), and each of layers forming the memory cell MC2 (barriermetal layer 241A, electrode layer 242A, insulating layer 243A, barriermetal layer 244A, metal layer 245A, barrier metal layer 246A, andconductive layer 247A) are divided in the X direction along the patternof the bit line BL. As a result, the memory cell MC1 (barrier metallayer 221, metal layer 222, insulating layer 223, electrode layer 224,barrier metal layer 225, and conductive layer 226) and the bit line BLare formed.

Note that as shown in FIGS. 36 to 38, this step is performed such thatthe word line WL1 (barrier metal layer 211 and conductive layer 212) isnot divided in the X direction. Therefore, at this time point, each ofthe layers forming the bit line BL (barrier metal layer 231A andconductive layer 232A) are not completely divided, and are formedcontinuously in the bit line contact region BCR.

Next, as shown in FIGS. 39 to 43, a mask 321 covering the memory regionsMR1 and MR2 is formed.

Next, as shown in FIGS. 44 to 46, this mask 321 and the mask 311 areutilized to divide each of the layers forming the bit line BL (barriermetal layer 231A and conductive layer 232A), in the X direction. As aresult, each of the layers forming the bit line BL (barrier metal layer231A and conductive layer 232A) are completely divided in the Xdirection, and the bit line contact CB (barrier metal layer 231 andconductive layer 232) is formed.

Next, step S108 will be described with reference to FIG. 13 and FIGS. 47to 49. FIG. 47 is a plan view for explaining step S108. FIGS. 48 and 49are cross-sectional views for explaining step S108, and respectivelyshow cross-sections corresponding to B-B and C-C of FIG. 47.

As shown in FIG. 13 and FIGS. 47 to 49, in step S108, an inter-layerinsulating layer 262 is formed. For example, the nitride layer 261 isdeposited on sidewalls in the X direction of each of the layers formingthe memory cells MC1 (barrier metal layer 221, metal layer 222,insulating layer 223, electrode layer 224, barrier metal layer 225, andconductive layer 226), the bit lines BL and bit line contacts CB(barrier metal layer 231 and conductive layer 232), and the memory cellsMC2 (barrier metal layer 241A, electrode layer 242A, insulating layer243A, barrier metal layer 244A, metal layer 245A, barrier metal layer246A, and conductive layer 247A) adjacent in the X direction and on theupper surface of the inter-layer insulating layer 111. The nitride layer261 is configured from silicon nitride (SiN), for example. Next, theinter-layer insulating layer 262 is implanted between the nitride layers261. The inter-layer insulating layer 262 is configured from siliconoxide (SiO₂), for example.

Next, step S109 will be described with reference to FIGS. 13, 50, and51. FIG. 50 is a plan view for explaining step S109. FIG. 51 is across-sectional view for explaining step S109, and shows a cross-sectioncorresponding to B-B of FIG. 50.

As shown in FIGS. 13, 50, and 51, in step S109, a trench Slit2 is formedin the inter-layer insulating layer 262. The trench Slit2 extends in theY direction along the word line contact regions WCR1 and WCR2. Moreover,the inter-layer insulating layer 111, barrier metal layer 112, andconductive layer 113 of the lower wiring line layer 100 are exposed at alower surface of the trench Slit2. Note that the trench Slit2 may beformed by a similar method to that for the trench Slit1.

Next, step S110 will be described with reference to FIGS. 13, 52, and53. FIG. 52 is a cross-sectional view for explaining step S110.

As shown in FIGS. 13, 52, and 53, in step S110, a layer forming the wordline WL2 and word line contact CW is deposited. For example, first, abarrier metal layer 251A and a conductive layer 252A that form the wordline WL2 and word line contact CW, are sequentially deposited. Thebarrier metal layer 251A is configured from a conductive layer of thelikes of titanium (Ti), for example. The conductive layer 252A isconfigured from a conductive layer of the likes of tungsten (W), forexample.

Now, as shown in FIGS. 52 and 53, the barrier metal layer 251A andconductive layer 252A cover upper surfaces of the conductive layer 247Aand the inter-layer insulating layer 262. Moreover, the barrier metallayer 251A and conductive layer 252A are implanted also on the inside ofthe trench Slit2, and contact the inter-layer insulating layer ill,barrier metal layer 112, and conductive layer 113 of the lower wiringline layer 100 at the lower surface of the trench Slit2.

Next, step S111 will be described with reference to FIG. 13 and FIGS. 54to 64. FIGS. 54, 56, 60, and 62 are plan views for explaining step S111.FIG. 55 is a cross-sectional view for explaining step S111, and shows across-section corresponding to A-A of FIG. 54. FIGS. 57 to 59 arecross-sectional views for explaining step S111, and respectively showcross-sections corresponding to A-A, D-D, and F-F of FIG. 56. FIG. 61 isa cross-sectional view for explaining step S111, and shows across-section corresponding to F-F of FIG. 60. FIGS. 63 and 64 arecross-sectional views for explaining step S111, and respectively showcross-sections corresponding to D-D and F-F of FIG. 62.

As shown in FIG. 13 and FIGS. 54 to 64, in step S111, formation of thememory cell MC2, the word line WL2, and the word line contact CW, areperformed.

For example, as shown in FIGS. 54 and 55, first, a mask 331 is formed.The mask 331 is formed in a line-and-space pattern along a pattern ofthe word line WL2. Moreover, the mask 331 is formed straddling thememory regions MR1 and MR2 and the word line contact regions WCR1 andWCR2.

Next, as shown in FIGS. 56 to 59, the mask 331 is utilized, and each oflayers forming the memory cell MC2 (barrier metal layer 241A, electrodelayer 242A, insulating layer 243A, barrier metal layer 244A, metal layer245A, barrier metal layer 246A, and conductive layer 247A) and each oflayers forming the word line WL2 (barrier metal layer 251A andconductive layer 252A) are divided in the Y direction along the patternof the word line WL2. As a result, the memory cell MC2 (barrier metallayer 241, electrode layer 242, insulating layer 243, barrier metallayer 244, metal layer 245, barrier metal layer 246, and conductivelayer 247) and the word line WL2 are formed.

Note that as shown in FIGS. 58 and 59, this step is performed such thatthe bit line BL (barrier metal layer 231 and conductive layer 232) isnot divided in the Y direction. Therefore, at this time point, each ofthe layers forming the word line WL2 (barrier metal layer 251A andconductive layer 252A) are not completely divided, and are formedcontinuously in the word line contact regions WCR1 and WCR2.

Next, as shown in FIGS. 60 and 61, a mask 341 covering the memoryregions MR1 and MR2 and bit line contact region BCR, is formed.

Next, as shown in FIGS. 62 to 64, this mask 341 and the mask 331 areutilized to divide each of the layers forming the word line WL2 (barriermetal layer 251A and conductive layer 252A), in the Y direction. As aresult, each of the layers forming the word line WL2 (barrier metallayer 251A and conductive layer 252A) are completely divided in the Ydirection, and the word line contact CW (barrier metal layer 251 andconductive layer 252) is formed.

Subsequently, as shown in FIG. 13 and FIGS. 6 to 12, in step S112, aninter-layer insulating layer 249 is formed. For example, a nitride layer248 is deposited on sidewalls in the Y direction of the memory cells MC2(barrier metal layer 241, electrode layer 242, insulating layer 243,barrier metal layer 244, metal layer 245, barrier metal layer 246, andconductive layer 247) and the word lines WL2 (barrier metal layer 251and conductive layer 252) adjacent in the Y direction and on the uppersurface of the inter-layer insulating layer 111. The nitride layer 248is configured from silicon nitride (SiN), for example. Next, theinter-layer insulating layer 249 is implanted between the nitride layers248. The inter-layer insulating layer 249 is configured from siliconoxide (SiO₂), for example.

The above steps make it possible to manufacture the nonvolatilesemiconductor memory device described with reference to FIGS. 6 to 12.

As a result of the method of manufacturing according to the presentembodiment, as described with reference to FIGS. 27 and 28, theconductive layer 232A is deposited inside the trench Slit1 extending inthe X direction and this is utilized to form the bit line contact CB,hence positions in the Y direction of the bit line contacts CB can besubstantially matched. In addition, as a result of such a method, asdescribed with reference to FIGS. 30 to 33, the masks 311 to 314 of thepattern corresponding to the bit line BL is formed and this is utilizedto form the bit line BL and the bit line contact CB, hence a position inthe X direction of the bit line BL and a position in the X direction ofthe bit line contact CB can be substantially matched.

Similarly, as a result of the method of manufacturing according to thepresent embodiment, as described with reference to FIG. 53, theconductive layer 252A is deposited inside the trench Slit2 extending inthe Y direction and this is utilized to form the word line contact CW,hence positions in the X direction of the word line contacts CW can besubstantially matched. In addition, as a result of such a method, asreference to FIGS. 54 and 55, the mask 331 of the pattern correspondingto the word line WL is formed and this is utilized to form the word lineWL and the word line contact CW, hence a position in the Y direction ofthe word line WL and a position in the Y direction of the word linecontact CW can be substantially matched.

Moreover, in the method of manufacturing according to the presentembodiment, as described with reference to FIG. 25, for example, thetrench Slit1 is formed such that the inter-layer insulating layer 111,barrier metal layer 112, and conductive layer 113 of the lower wiringline layer 100 are exposed at the lower surface of the trench Slit1.Such a mode makes it possible for positions of the bit line contacts CBand each of configurations of the lower wiring line layer 100 to bealigned by adjusting a position in the Y direction of the trench Slit1.Therefore, manufacturing can be performed more easily compared to when,for example, positions in the X direction and the Y direction must bealigned.

Note that when the nonvolatile semiconductor memory device ismanufactured by the method of manufacturing according to the presentembodiment, as shown in FIG. 7, the lower surface of the bit line BL andthe side surface in the Y direction and lower surface of the bit linecontact CB are sometimes covered by the barrier metal layer 231. Incontrast, as shown in FIG. 9, the side surfaces in the X direction ofthe bit line BL and bit line contact CB are sometimes covered by thenitride layer 261.

Moreover, when the nonvolatile semiconductor memory device ismanufactured by the method of manufacturing according to the presentembodiment, as shown in FIG. 9, the side surface in the Y direction ofthe bit line BL and the side surface in the Y direction of the bit linecontact CB are sometimes formed continuously.

Moreover, in the method of manufacturing according to the presentembodiment, in step S107, as described with reference to FIGS. 39 to 43,the mask 321 covering the memory regions MR1 and MR2 is formed, and asdescribed with reference to FIGS. 44 to 46, this mask 321 and the mask311 are utilized to divide each of the layers forming the bit line BL,in the X direction. Therefore, as shown in FIG. 11, an end 228 a in theY direction of the inter-layer insulating layer 228 is resultantlypositioned between the bit line contact CB and the word line WL1, at aposition between the bit lines BL. Moreover, as shown in FIG. 11, whenthe nitride layer 261 and the inter-layer insulating layer 262 areformed in step S108, these nitride layer 261 and inter-layer insulatinglayer 262 resultantly contact the end 228 a in the Y direction of theinter-layer insulating layer 228.

Moreover, as a result of the method of manufacturing according to thepresent embodiment, the word line contact CW is formed similarly to thebit line contact CB, and similar advantages can be displayed inmanufacturing steps of the word line contact CW.

Other Embodiments

Note that in the present embodiment, the bit line contact CB and theword line contact CW had substantially similar configurations. However,it is also possible for different configurations to be adopted as thebit line contact CB or the word line contact CW, for example.

[Others]

While certain embodiments have been described, these embodiments havebeen presented by way of example only, and are not intended to limit thescope of the inventions. Indeed, the novel methods and systems describedherein may be embodied in a variety of other forms; furthermore, variousomissions, substitutions and changes in the form of the methods andsystems described herein may be made without departing from the spiritof the inventions. The accompanying claims and their equivalents areintended to cover such forms or modifications as would fall within thescope and spirit of the inventions.

What is claimed is:
 1. A memory device comprising: a substrate; a firstwiring extending in a first direction; a second wiring being adjacent tothe first wiring in a second direction parallel to the substrate andcrossing the first direction, the second wiring extending in the firstdirection; a third wiring being provided between the substrate and thefirst wiring, the third wiring being provided between the substrate andthe second wiring, the third wiring extending in the second direction; afirst memory cell being provided between the first wiring and the thirdwiring; a second memory cell being provided between the second wiringand the third wiring; a first contact being provided between the firstwiring and the second wiring in the second direction, the first contactextending in a third direction perpendicular to a surface of thesubstrate, and one end of the first contact being connected to the thirdwiring; a second contact extending in the third direction, and one endof the second contact being connected to the first wiring; and a thirdcontact extending in the third direction, and one end of the thirdcontact being connected to the second wiring.
 2. The memory deviceaccording to claim 1 a fourth contact being located below the thirdwiring in the third direction, one end of the fourth contact beingconnected to the other end of the second contact, and the fourth contactextending in the third direction; a fifth contact being located belowthe third wiring in the third direction, one end of the fifth contactbeing connected to the other end of the first contact, and the fifthcontact extending in the third direction.
 3. The memory device accordingto claim 2, wherein a first length of the second contact in the thirddirection from a connecting surface of the first wiring to a connectingsurface of the fourth contact is longer than a second length of thefirst contact in the third direction from a connecting surface of thethird wiring to a connecting surface of the fifth contact.
 4. The memorydevice according to claim 2, wherein the second contact is integratedtogether from a connecting surface of the first wiring to the fourthcontact.
 5. The memory device according to claim 2, wherein the secondcontact and third contact includes a first conductive portion and asecond conductive portion, the first conductive portion provided in alayer which the first contact is provided, the second conductive portionprovided in a layer which the third wiring is provided, and the firstconductive portion and the second conductive portion formed of one body.6. The memory device according to claim 5, wherein the first conductiveportion and the second conductive portion is formed of one body bytungsten.
 7. The memory device according to claim 5, wherein a layerincluding titanium is continuously provided on sidewalls of the firstconductive portion and the second conductive portion.
 8. The memorydevice according to claim 2, wherein the second contact is provided in afirst layer different from a second layer in which the fourth contact isprovided.
 9. The memory device according to claim 1, further comprisinga first film being provided on the first wiring and the second wiring.10. The memory device according to claim 9, wherein the first filmincludes a nitride.
 11. A memory device comprising: a substrate; aplurality of first wirings extending in a first direction and beingarranged at a second direction parallel to the substrate and crossingthe first direction; a plurality of second wirings being adjacent to theplurality of the first wirings in the second direction, the plurality ofsecond wirings extending in the first direction and being arranged atthe second direction; a plurality of third wirings being providedbetween the substrate and the plurality of first wirings, the pluralityof third wirings being provided between the substrate and the pluralityof second wirings, extending in the second direction, the plurality ofthe third wirings being arranged at the first direction; first memorycells being provided between the plurality of first wirings and theplurality of third wirings; second memory cells being provided betweenthe plurality of second wirings and the plurality of third wirings; afirst contact being provided between the first memory cells and thesecond memory cells in the second direction, the first contact extendingin a third direction perpendicular to a surface of the substrate, andone end of the first contact being connected to one of the plurality ofthe third wirings; a second contact extending in the third direction,and one end of the second contact being connected to one of theplurality of the first wirings; and a third contact extending in thethird direction, and one end of the third contact being connected to oneof the plurality of the second wirings.
 12. The memory device accordingto claim 11, further comprising: a fourth contact being located belowthe plurality of third wirings in the third direction, one end of thefourth contact being connected to the other end of the second contact,and the fourth contact extending in the third direction; and a fifthcontact being located below the plurality of third wiring in the thirddirection, one end of the fifth contact being connected to the other endof the first contact, and the fifth contact extending in the thirddirection.
 13. The memory device according to claim 12, wherein a firstlength of the second contact in the third direction from a connectingsurface of the first wiring to a connecting surface of the fourthcontact is longer than a second length of the first contact in the thirddirection from a connecting surface of the third wiring to a connectingsurface of the fifth contact.
 14. The memory device according to claim12, wherein the second contact is integrated together from a connectingsurface of the first wiring to the fourth contact.
 15. The memory deviceaccording to claim 12, wherein the second contact and third contactincludes a first conductive portion and a second conductive portion, thefirst conductive portion provided in a layer which the first contact isprovided, the second conductive portion provided in a layer which thethird wiring is provided, and the first conductive portion and thesecond conductive portion formed of one body.
 16. The memory deviceaccording to claim 15, wherein the first conductive portion and thesecond conductive portion is formed of one body by tungsten.
 17. Thememory device according to claim 15, wherein a layer including titaniumis continuously provided on sidewalls of the first conductive portionand the second conductive portion.
 18. The memory device according toclaim 12, wherein the second contact is provided in a first layerdifferent from a second layer in which the fourth contact is provided.19. The memory device according to claim 11, further comprising a firstfilm being provided on the plurality of first wirings and the pluralityof the second wirings.
 20. The memory device according to claim 19,wherein the first film includes a nitride.